Jim Hisert’s Blog

Jim Hisert

Applications Engineer
Indium Corporation
Ph: 315-853-4900
Email: jhisert@indium.com
Address: 1676 Lincoln Ave., Utica, NY, USA 13502

Jim is an Applications Engineer for Indium Corporation, supporting Indium’s Semiconductor Assembly Products. He is especially knowledgeable in the area of precision flux application and his expertise in semiconductor packaging has helped numerous companies to advance in this area. Jim has presented at various industry organizations and technical seminars, and has authored technical papers on thermal management as well as semiconductor packaging assembly. In addition, he was awarded the Silver Quill award for his educational and instructive “Thermal Interface Materials” presentation.

Previous to his time with Indium Corporation, Jim served as a Mechanical Engineer at Fiber Instrument Sales where he designed and patented a new fiber optic sensor. This position has given him the vision of a process/design engineer, which allows him to connect with his current customers.

He has a BS in Mechanical Engineering Technology from the State University of New York Institute of Technology and he is a member of the American Society of Mechanical Engineers.

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The opinions expressed here are the personal opinions of Jim Hisert. Content published here is not read or approved by the Indium Corporation and does not necessarily represent the views and opinions of the company. In addition, they are not guaranteed to be correct, complete, or up-to-date. By using this blog site you understand that any information or advice is of a general nature and may not apply to your specific situation. It is the reader’s responsibility to confirm and verify all information prior to implementing any endeavors based on the information. This blog/website should not be used as a substitute for competent personal advice from a trusted professional.