Halogen-Free vs. Halide-Free Redo
Sep 5, 2008
As I discuss the differences between “halogen-free” and “halide-free” with respect to solder pastes and fluxes for electronics assembly, I struggle to explain it in a concise manner without going too deep into chemistry. To follow is now how I explain the differences.
The term halide-free was developed many years...
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Are You Ready for SMTA Process Engineer Certification (With Solution Update)
Aug 24, 2008
Folks,
Since 2002 SMTA has had an SMT Process Engineer Certification Program that was developed by Jim Hall, Phil Zarrow and me. Some folks are a little nervous about taking the workshop and exam. In light of this concern, I have been asked by the Ohio span...
Applying TacFlux to a Solder Thermal Interface Material
Sep 5, 2008
The process of applying a solder thermal interface material typically
includes applying flux to a solder preform and reflowing it in a sandwich
between two substrates. When a preform
comes flux coated, it’s a no-brainer how to apply the flux to the preform. It’s
already done for you.
p...
Package-on-Package Solder Paste for a High Yield Process
Aug 25, 2008
From a mechanical perspective, larger solder joints are generally preferred when assembling package-on-package (PoP) components. Just as a large set of gears can handle more power, fortified interconnects add a measure of reliability to BGAs and CSPs. span style="mso-spacerun:...
Issues with using Indium for Wafer Bumping
Sep 5, 2008
Lets talk about some issues…
The first thing that I am worried about is the use of a small particle size of Indium-containing alloys. Indium is self-passivating, and will clump and cold weld to itself, even...
Indium Corporation
